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CBT3257A
Quad 1-of-2 multiplexer/demultiplexer
Rev. 01 -- 27 October 2005 Product data sheet
1. General description
The CBT3257A is a quad 1-of-2 high-speed TTL-compatible multiplexer/demultiplexer. The low ON-state resistance of the switch allows inputs to be connected to outputs without adding propagation delay or generating additional ground bounce noise. Output enable (OE) and select-control (S) inputs select the appropriate nB1 and nB2 outputs for the nA input data. The CBT3257A is characterized for operation from -40 C to +85 C.
2. Features
5 switch connection between two ports TTL-compatible input levels Minimal propagation delay through the switch ESD protection exceeds 2000 V HBM per JESD22-A114, 200 V MM per JESD22-A115 and 1000 V CDM per JESD22-C101 s Latch-up testing is done to JEDEC standard JESD78 which exceeds 100 mA s s s s
3. Ordering information
Table 1: Ordering information Tamb = -40 C to +85 C Type number CBT3257AD Topside mark CBT3257AD Package Name SO16 SSOP16 SSOP16 [1] Description plastic small outline package; 16 leads; body width 3.9 mm plastic shrink small outline package; 16 leads; body width 5.3 mm plastic shrink small outline package; 16 leads; body width 3.9 mm; lead pitch 0.635 mm plastic thin shrink small outline package; 16 leads; body width 4.4 mm Version SOT109-1 SOT338-1 SOT519-1
CBT3257ADB C3257A CBT3257ADS CT3257A
CBT3257APW CBT3257A
[1] Also known as QSOP16.
TSSOP16
SOT403-1
Philips Semiconductors
CBT3257A
Quad 1-of-2 multiplexer/demultiplexer
4. Functional diagram
4 2
1A
1B1
3
1B2
2A
7
5
2B1
6
2B2
3A
9
11
3B1
10
3B2
4A
12
14
4B1
13
4B2
S
1
OE
15
002aab779
Fig 1. Logic diagram of CBT3257A (positive logic)
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Product data sheet
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5. Pinning information
5.1 Pinning
S 1B1 1B2 1A 2B1 2B2 2A GND
1 2 3 4
16 VCC 15 OE 14 4B1 13 4B2 S 1B1 1B2 1A 2B1 2B2 1 2 3 4 5 6 7 8
002aab769
16 VCC 15 OE 14 4B1 13 4B2 12 4A 11 3B1 10 3B2 9 3A
CBT3257AD
5 6 7 8
002aab768
12 4A 11 3B1 10 3B2 9 3A
CBT3257ADB
2A GND
Fig 2. Pin configuration for SO16
Fig 3. Pin configuration for SSOP16
S 1B1 1B2 1A 2B1 2B2 2A GND
1 2 3 4 5 6 7 8
002aab770
16 VCC 15 OE 14 4B1 13 4B2 12 4A 11 3B1 10 3B2 9 3A
S 1B1 1B2 1A 2B1 2B2 2A GND
1 2 3 4 5 6 7 8
002aab771
16 VCC 15 OE 14 4B1 13 4B2 12 4A 11 3B1 10 3B2 9 3A
CBT3257ADS
CBT3257APW
Fig 4. Pin configuration for SSOP16 (QSOP16)
Fig 5. Pin configuration for TSSOP16
5.2 Pin description
Table 2: Symbol S 1B1, 1B2, 2B1, 2B2, 3B1, 3B2, 4B1, 4B2 1A, 2A, 3A, 4A GND OE VCC
[1]
Pin description Pin 1 2, 3, 5, 6, 10, 11, 13, 14 4, 7, 9, 12 8 15 16 Description select control input B outputs [1] A inputs ground (0 V) output enable (active LOW) positive supply voltage
B outputs are inputs if A inputs are outputs.
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Quad 1-of-2 multiplexer/demultiplexer
6. Functional description
Refer to Figure 1 "Logic diagram of CBT3257A (positive logic)".
6.1 Function table
Table 3: Function selection H = HIGH voltage level; L = LOW voltage level; X = Don't care Inputs OE L L H S L H X A port = B1 port A port = B2 port disconnect Function
7. Limiting values
Table 4: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VCC VI ICCC IIK Tstg
[1]
Parameter supply voltage input voltage continuous current through each VCC or GND pin input clamping current storage temperature
Conditions
[1]
Min -0.5 -0.5 -
Max +7.0 +7.0 128 -50 +150
Unit V V mA mA C
VI < 0 V
-65
The input and output negative voltage ratings may be exceeded if the input and output clamp current ratings are observed.
8. Recommended operating conditions
Table 5: Operating conditions All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Symbol VCC VIH VIL Tamb Parameter supply voltage HIGH-state input voltage LOW-state input voltage ambient temperature operating in free-air Conditions Min 4.5 2.0 -40 Typ Max 5.5 0.8 +85 Unit V V V C
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CBT3257A
Quad 1-of-2 multiplexer/demultiplexer
9. Static characteristics
Table 6: Static characteristics Tamb = -40 C to +85 C Symbol VIK Vpass ILI ICC ICC Ci Cio(off) Ron Parameter input clamping voltage pass voltage input leakage current quiescent supply current additional quiescent supply current input capacitance (control pins) off-state input/output capacitance ON-state resistance Conditions VCC = 4.5 V; II = -18 mA VI = VCC = 5.0 V; IO = -100 A VCC = 5.5 V; VI = GND or 5.5 V VCC = 5.5 V; IO = 0 mA; VI = VCC or GND per input; VCC = 5.5 V; one input at 3.4 V, other inputs at VCC or GND VI = 3 V or 0 V A port; VO = 3 V or 0 V; OE = VCC B port; VO = 3 V or 0 V; OE = VCC VCC = 4.5 V VI = 0 V; II = 64 mA VI = 0 V; II = 30 mA VI = 2.4 V; II = 15 mA
[1] [2] [3] All typical values are at VCC = 5 V; Tamb = 25 C. This is the increase in supply current for each input that is at the specified TTL voltage level rather than VCC or GND. Measured by the voltage drop between the A and the B terminals at the indicated current through the switch. ON-state resistance is determined by the lowest voltage of the two (A or B) terminals.
[3] [2]
Min 3.4 -
Typ [1] 3.6 3.3 9.9 6.4 5 5 10
Max -1.2 3.9 1 3 2.5 7 7 15
Unit V V A A mA pF pF pF
10. Dynamic characteristics
Table 7: Dynamic characteristics Tamb = -40 C to +85 C; VCC = 5.0 V 0.5 V; CL = 50 pF; unless otherwise specified. Symbol tPD Parameter propagation delay Conditions from nA input to nBn output, or from nBn input to nA output from S input to nA output ten tdis enable time disable time from OE input to nA or nBn output from S input to nBn output from OE input to nA or nBn output from S input to nBn output
[1] [2] [3]
[1]
Min 1.6 1.8 1.6 2.2 1.0
Typ -
Max 0.25 5.0 5.1 5.2 5.5 5.0
Unit ns ns ns ns ns ns
[1] [2] [2] [3] [3]
This parameter is warranted but not production tested. The propagation delay is based on the RC time constant of the typical ON-state resistance of the switch and a load capacitance, when driven by an ideal voltage source (zero output impedance). Output enable time to HIGH and LOW level. Output disable time from HIGH and LOW level.
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Product data sheet
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CBT3257A
Quad 1-of-2 multiplexer/demultiplexer
10.1 AC waveforms
VI = GND to 3.0 V. tPLZ and tPHZ are the same as tdis. tPZL and tPZH are the same as ten. tPLH and tPHL are the same as tPD.
3.0 V input 1.5 V tPLH 1.5 V 0V tPHL VOH output 1.5 V 1.5 V VOL
002aab665
Fig 6. Input to output propagation delays
3V output control (LOW-level enabling) 1.5 V tPZL output waveform 1 S1 at 7 V(1) tPZH output waveform 2 S1 open(2) 1.5 V 0V tPLZ 3.5 V 1.5 V VOL + 0.3 V tPHZ VOL - 0.3 V
002aab666
VOL VOH 0V
1.5 V
(1) Waveform 1 is for an output with internal conditions such that the output is LOW except when disabled by the output control. (2) Waveform 2 is for an output with internal conditions such that the output is HIGH except when disabled by the output control.
Fig 7. 3-state output enable and disable times
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11. Test information
RL S1
from output under test
CL 50 pF
500 RL 500
7V open GND
002aab667
Test data are given in Table 8. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz; Zo = 50 ; tr 2.5 ns; tf 2.5 ns. The outputs are measured one at a time with one transition per measurement. CL = load capacitance includes jig and probe capacitance. RL = load resistance.
Fig 8. Test circuit Table 8: Test tPD tPLZ, tPZL tPHZ, tPZH Test data Load CL 50 pF 50 pF 50 pF RL 500 500 500 open 7V open Switch
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Product data sheet
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CBT3257A
Quad 1-of-2 multiplexer/demultiplexer
12. Package outline
SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1
D
E
A X
c y HE vMA
Z 16 9
Q A2 pin 1 index Lp 1 e bp 8 wM L detail X A1 (A 3) A
0
2.5 scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. OUTLINE VERSION SOT109-1 REFERENCES IEC 076E07 JEDEC MS-012 JEITA EUROPEAN PROJECTION A max. 1.75 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 10.0 9.8 E (1) 4.0 3.8 0.16 0.15 e 1.27 0.05 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 0.039 0.016 Q 0.7 0.6 0.028 0.020 v 0.25 0.01 w 0.25 0.01 y 0.1 Z (1) 0.7 0.3
0.010 0.057 0.069 0.004 0.049
0.019 0.0100 0.39 0.014 0.0075 0.38
0.244 0.041 0.228
0.028 0.004 0.012
8 o 0
o
ISSUE DATE 99-12-27 03-02-19
Fig 9. Package outline SOT109-1 (SO16)
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CBT3257A
Quad 1-of-2 multiplexer/demultiplexer
SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm
SOT338-1
D
E
A X
c y HE vM A
Z 16 9
Q A2 A1 pin 1 index Lp L 1 bp 8 wM detail X (A 3) A
e
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 2 A1 0.21 0.05 A2 1.80 1.65 A3 0.25 bp 0.38 0.25 c 0.20 0.09 D (1) 6.4 6.0 E (1) 5.4 5.2 e 0.65 HE 7.9 7.6 L 1.25 Lp 1.03 0.63 Q 0.9 0.7 v 0.2 w 0.13 y 0.1 Z (1) 1.00 0.55 8 o 0
o
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT338-1 REFERENCES IEC JEDEC MO-150 JEITA EUROPEAN PROJECTION
ISSUE DATE 99-12-27 03-02-19
Fig 10. Package outline SOT338-1 (SSOP16)
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Product data sheet
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CBT3257A
Quad 1-of-2 multiplexer/demultiplexer
SSOP16: plastic shrink small outline package; 16 leads; body width 3.9 mm; lead pitch 0.635 mm
SOT519-1
D
E
A X
c y HE vM A
Z 16 9
A2 A1 (A 3) Lp L 1 e bp 8 wM detail X
A
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.73 A1 0.25 0.10 A2 1.55 1.40 A3 0.25 bp 0.31 0.20 c 0.25 0.18 D (1) 5.0 4.8 E (1) 4.0 3.8 e 0.635 HE 6.2 5.8 L 1 Lp 0.89 0.41 v 0.2 w 0.18 y 0.09 Z (1) 0.18 0.05 8o o 0
Note 1. Plastic or metal protrusions of 0.2 mm maximum per side are not included. OUTLINE VERSION SOT519-1 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION
ISSUE DATE 99-05-04 03-02-18
Fig 11. Package outline SOT519-1 (SSOP16)
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Product data sheet
Rev. 01 -- 27 October 2005
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CBT3257A
Quad 1-of-2 multiplexer/demultiplexer
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm
SOT403-1
D
E
A
X
c y HE vMA
Z
16
9
Q A2 pin 1 index A1 Lp L (A 3) A
1
e bp
8
wM detail X
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.1 A1 0.15 0.05 A2 0.95 0.80 A3 0.25 bp 0.30 0.19 c 0.2 0.1 D (1) 5.1 4.9 E (2) 4.5 4.3 e 0.65 HE 6.6 6.2 L 1 Lp 0.75 0.50 Q 0.4 0.3 v 0.2 w 0.13 y 0.1 Z (1) 0.40 0.06 8 o 0
o
Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT403-1 REFERENCES IEC JEDEC MO-153 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-18
Fig 12. Package outline SOT403-1 (TSSOP16)
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CBT3257A
Quad 1-of-2 multiplexer/demultiplexer
13. Soldering
13.1 Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended.
13.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 seconds and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 C to 270 C depending on solder paste material. The top-surface temperature of the packages should preferably be kept:
* below 225 C (SnPb process) or below 245 C (Pb-free process)
- for all BGA, HTSSON..T and SSOP..T packages - for packages with a thickness 2.5 mm - for packages with a thickness < 2.5 mm and a volume 350 mm3 so called thick/large packages.
* below 240 C (SnPb process) or below 260 C (Pb-free process) for packages with a
thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages. Moisture sensitivity precautions, as indicated on packing, must be respected at all times.
13.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results:
* Use a double-wave soldering method comprising a turbulent wave with high upward
pressure followed by a smooth laminar wave.
* For packages with leads on two sides and a pitch (e):
- larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board;
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- smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end.
* For packages with leads on four sides, the footprint must be placed at a 45 angle to
the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 C or 265 C, depending on solder material applied, SnPb or Pb-free respectively. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
13.4 Manual soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 seconds to 5 seconds between 270 C and 320 C.
13.5 Package related soldering information
Table 9: Package [1] BGA, HTSSON..T [3], LBGA, LFBGA, SQFP, SSOP..T [3], TFBGA, VFBGA, XSON DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, HSQFP, HSSON, HTQFP, HTSSOP, HVQFN, HVSON, SMS PLCC [5], SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO, VSSOP CWQCCN..L [8], PMFP [9], WQCCN..L [8]
[1] [2]
Suitability of surface mount IC packages for wave and reflow soldering methods Soldering method Wave not suitable not suitable [4] Reflow [2] suitable suitable
suitable not not recommended [5] [6] recommended [7]
suitable suitable suitable not suitable
not suitable
For more detailed information on the BGA packages refer to the (LF)BGA Application Note (AN01026); order a copy from your Philips Semiconductors sales office. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 C 10 C measured in the atmosphere of the reflow oven. The package body peak temperature must be kept as low as possible.
[3]
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CBT3257A
Quad 1-of-2 multiplexer/demultiplexer
[4]
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar soldering process. The appropriate soldering profile can be provided on request. Hot bar soldering or manual soldering is suitable for PMFP packages.
[5] [6] [7] [8]
[9]
14. Abbreviations
Table 10: Acronym CDM ESD HBM MM PRR TTL Abbreviations Description Charged Device Model ElectroStatic Discharge Human Body Model Machine Model Pulse Rate Repetition Transistor-Transistor Logic
15. Revision history
Table 11: Revision history Release date 20051027 Data sheet status Product data sheet Change notice Doc. number 9397 750 12921 Supersedes Document ID CBT3257A_1
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16. Data sheet status
Level I II Data sheet status [1] Objective data Preliminary data Product status [2] [3] Development Qualification Definition This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN).
III
Product data
Production
[1] [2] [3]
Please consult the most recently issued data sheet before initiating or completing a design. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
17. Definitions
Short-form specification -- The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition -- Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information -- Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification.
customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes -- Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status `Production'), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
19. Trademarks
Notice -- All referenced brands, product names, service names and trademarks are the property of their respective owners.
18. Disclaimers
Life support -- These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors
20. Contact information
For additional information, please visit: http://www.semiconductors.philips.com For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com
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Quad 1-of-2 multiplexer/demultiplexer
21. Contents
1 2 3 4 5 5.1 5.2 6 6.1 7 8 9 10 10.1 11 12 13 13.1 13.2 13.3 13.4 13.5 14 15 16 17 18 19 20 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 4 Function table . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 Recommended operating conditions. . . . . . . . 4 Static characteristics. . . . . . . . . . . . . . . . . . . . . 5 Dynamic characteristics . . . . . . . . . . . . . . . . . . 5 AC waveforms. . . . . . . . . . . . . . . . . . . . . . . . . . 6 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Introduction to soldering surface mount packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 12 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 12 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 13 Package related soldering information . . . . . . 13 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 14 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 15 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Contact information . . . . . . . . . . . . . . . . . . . . 15
(c) Koninklijke Philips Electronics N.V. 2005
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Date of release: 27 October 2005 Document number: 9397 750 12921
Published in The Netherlands

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